Analysis of Viscoelastic Behavior of Epoxy Molding Compound and its Application in the Warpage Simulation of Strip Molded Electronic Packages
碩士 === 國立成功大學 === 機械工程學系 === 105 === Epoxy molding compound (EMC) is widely used in electronic packages for encapsulating the Si die. During packaging thermal processes, the thermal expansion mismatch between various packaging materials and physical or chemical aging induced EMC volume change would...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/k2n6ag |