Intermetallic Layers in Cu/Solder Joints for Advanced Electronic Packaging
博士 === 國立交通大學 === 材料科學與工程學系所 === 105 === The integration and miniaturization trends in electronic packaging have led to a substantially finer pitch of the device and package lead terminations. Several reliability concerns that have previously not been encountered are currently surfacing. This study...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w679s9 |