Tensile and Fatigue Tests of Highly <111>-oriented Nanotwinned Cu Films
碩士 === 國立交通大學 === 材料科學與工程學系所 === 105 === Electroplated Cu has been extensively used in wafer level packaging (WLP) interconnect material such as RDL (Redistribution Layer). However, it is easier to lead to failure because of the mismatch of the thermal expansion coefficient between Si and molding co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3huvxj |