A Study of Effect of Sn Grain Orientation on Electromigration in Flip-chip Interconnections with Sn2.3Ag Solder of 65 μm Thickness
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 105 === As trends in integrated circuits miniaturization continues, flip-chip packaging became main method for packing of microelectronic devices. Recently the size of electronic devices become smaller and lighter. The required functions become higher than befor...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/qb6724 |