Correlation study between Cu surface microstructure and solderability of Cu surface by X-Ray photoelectron spectroscopy
博士 === 國立中央大學 === 化學工程與材料工程學系 === 105 === Cu always processed into mechanical cold work in technological industry. The surface rolling layer (SRL) would form on the Cu which is defined in previous research. The characteristics and thickness of SRL would affect the wetting performance between rolled-...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/27722667884059897344 |