The research of cleaning process with megasonic waves for SiC wafer
碩士 === 國立中央大學 === 機械工程學系在職專班 === 105 === 3D IC through Silicon via (TSV) technology is regarded as the next generation of mainstream packaging. It’s different than traditional flat packaging. The 3D IC turns the wire through the TSV directly through the wafer and the lower contact. Originally, it mu...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8c5t6j |