Development of small batch multi - pattern PCB welding oven for lead - free process.
碩士 === 國立中央大學 === 機械工程學系 === 105 === Purpose of the paper is to design a lead-free reflow oven. The oven can provide temperature profile for Lead-free Reflow Process, which is used for soldering SMD components placed on the printed circuit board. To make temperature even, System will adjust heaters’...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/uqrc22 |