Plasma Cleaning Optimization For Flip Chip Packaging Technology
碩士 === 國立高雄第一科技大學 === 電腦與通訊工程系碩士專班 === 105 === Flip Chip is the one of technology in Assembly, unlike the traditional Assembly, Flip chip connect the signal between die and substrate by using the bump on the die side instead of connect the signal between die and substrate by using wire. Plasma is an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76gwy8 |