Effects of solder ball shape, die thickness and underfill material properties on the plastic strain energy densityin an overmold CSP module under the conditions of reflow and underfill curing processes.
碩士 === 國立屏東科技大學 === 材料工程研究所 === 105
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fmf6pn |