Implementing Lean Six Sigma to improve the assembly yield of micro bump pitch IC substrate
碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 105 === abstract hide
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ewedw5 |