Lithography Optimization considering Post-Exposure Bake and the Photo-Acid Effect for 10-nm Node and Beyond

博士 === 國立臺灣大學 === 電子工程學研究所 === 105 === As one of the critical stages of a very large scale integration fabrication process, post-exposure bake (PEB) plays a crucial role in determining the final three-dimensional (3-D) profiles and lessening the standing wave effects. However, the full 3-D chemicall...

Full description

Bibliographic Details
Main Authors: Pei-Chun Lin, 林沛諄
Other Authors: 陳中平
Format: Others
Language:en_US
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/24377364865263256721