Electrical Modeling and Signal/Power Integrity Design in Three-Dimensional Memory Packaging
博士 === 國立臺灣大學 === 電信工程學研究所 === 105 === Mobile devices develop rapidly in recent few years, with the trends of the slim, low-power, and high bandwidth features. The three-dimensional integration such as Wide-I/O and LPDDR4 DRAM become the most popular technologies. This dissertation focuses on the in...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/apr3aw |