Study on Quasi-Orthogonal Machining of Elastomer Pad by Single-Point Diamond Tool
碩士 === 國立臺灣科技大學 === 機械工程系 === 105 === As patterns have become more challenging, higher wafer surface quality is crucial. Chemical Mechanical Polishing/ Planarization, CMP has been a popular process for semiconductor fabrication. In CMP process, a diamond dresser is usually applied to condition pad s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07468704883205175270 |