Temperature distribution and cutting force with estimation of bonding energy of single-crystal silicon with slurry effect
碩士 === 國立臺灣科技大學 === 機械工程系 === 105 === Abstract The paper uses down force to perform atomic force microscopic (AFM) machining of single-crystal silicon substrate unsoaked in slurry, and obtains the specific down force energy (SDFE) in the range of the single-crystal silicon substrate unsoaked in slur...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90020472661842171547 |