Study on Electrophoresis Deposition with Hybrid Slurry Wire Sawing Process of Single Crystalline Silicon Wafers
碩士 === 國立臺灣科技大學 === 機械工程系 === 105 === Silicon wafers are the key materials for fabricating semiconductor components. This study is to improve efficiency of slurry wire sawing (SWS) process by adding reactive abrasives into the slurry. The conventional free abrasive of SWS has been compared with the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62461604088075317317 |