Study on Electrophoresis Deposition with Hybrid Slurry Wire Sawing Process of Single Crystalline Silicon Wafers

• Main Authors: Chih-An Yang, 楊智安
• Other Authors: Chao-Chang A.Chen
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/62461604088075317317

碩士 === 國立臺灣科技大學 === 機械工程系 === 105 === Silicon wafers are the key materials for fabricating semiconductor components. This study is to improve efficiency of slurry wire sawing (SWS) process by adding reactive abrasives into the slurry. The conventional free abrasive of SWS has been compared with the Reactive SWS using the composite slurry with calcium carbonate abrasives that can induce solid-state chemical reaction (SSCR) with silicon. The reactants has been found as calcium silicate by Raman and EDS inspection. Moreover, an electrophoretic deposition process has been developed to enhance the Reactive SWS process. Use the EPD-WS to slice the substrates and measurement its surface quality. Also some 3" Silicon ingots have been sliced by revised DWS-150 machine with EPD function. From experimental results, adding calcium carbonate can significantly improve materials removal rate (MRR), the surface roughness and also reduce sub-surface crack length. Future study can apply this developed process on high-volume multi-wire sawing of semiconductor Silicon wafers.