The Phase Equilibria of the Au-Ni-Sn Ternary System and The Interfacial Reaction in the Au/Sn/Ni/Cu Multilayer System
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 105 === Au and Ni are widely used in Under Bump Metallurgy. Au is widely used as a anti-oxidation layer, because it has many advantages, such as good anti-oxidation, corrosion resistance and solderability. And Ni is widely used as a diffusion barrier to avoid interfa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w3yeqr |