Interfacial Reactions between Sn and Au-xCu Alloys
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 105 === Under bump metallurgy (UBM) plays an important role in the flip chip package, Cu is widely used as a wetting layer and Au usually acts as an anti-oxidation layer in UBM. The solid/solid interfacial reactions of Sn/Au-xCu at 150, 180 and 200oC for 5, 10, 20, 4...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77227058266858092208 |