The Investigation of Delamination Caused by CTE Mismatch in Semiconductor IC Package
碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === This research investigated the delamination of IC package caused by the coefficient of thermal expansion (CTE) of assembly material mismatch. In order to find a suitable material combination, leadframe products distributed by six assembly material combination...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/chw485 |