Preparation and application of thermal debonding adhesives
碩士 === 南臺科技大學 === 化學工程與材枓工程系 === 105 === In this study, thermal debonding adhesives can be prepared using the adhesive, thermal expansion particles (TEPs), hardener (PN-175) and ethyl acetate (EAC) by solution blending, which can be used as a bonding agent for wafer process. The adhesive has excelle...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33001755220901154089 |