Development of Machine Vision System for Solder Joint Failure Analysis
碩士 === 國立臺北科技大學 === 工業工程與管理系所 === 105 === BGA packaging technology has become the most popular form of packaging, in order to find out the case of solder joint failure under the package, Dye Stain Analysis technology is be used, however the inspectors may make mistakes due to fatigue, or differ in t...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/a8qb8q |