Optimizing the wire bonding process using silver alloy wire of laser diode
碩士 === 元智大學 === 工業工程與管理學系 === 105 === The researchs discusses the feasibility of applying silver alloy wires to the laser diode wires bonding process. Two basic damage tests: ball shear and wire pull, and seven environment reliability tests: mechanical shock, vibration, thermal shock, high temperatu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5854f8 |