Phase Equilibria of the Copper-Nickel-Palladium-Tin Quaternary System at 250 °C
博士 === 元智大學 === 化學工程與材料科學學系 === 105 === Sn–based alloys are the most promising Pb–free solders, and Ni/Pd surface finishes over Cu substrates have been widely used in microelectronic packaging to prevent pad oxidation before soldering and to improve the bond ability with Cu wires. To understand the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fh6ewr |