Warpage Simulation and Optimization Analysis of Fan-out Wafer Level Package Process
碩士 === 國防大學理工學院 === 航空太空工程碩士班 === 107 === Fan-out wafer level package (FOWLP) is one of most popular packaging technology in recent years. This is because FOWLP is considered as the key to break through the bottleneck of Moore’s Law, and it provides opportunities for the foundries to participate pac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a5bts3 |