Measurement and Simulation of Thermal Deformation of 2.5D IC Packages
碩士 === 長庚大學 === 機械工程學系 === 106 === With the needs and advance of electronic products and mobile devices, the electronic devices will be further developed to be with special features of smaller form factor, lower power consumption, higher efficiency and performance. The 2.5D IC packaging technology w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/wz62j9 |