A Study of Out-of Plane Deformation of Fan-out Wafer-level Package during Fabrication Process
碩士 === 逢甲大學 === 航太與系統工程學系 === 106 === Globally, consumer demand for electronic devices having small form factor, low cost, great functional diversification, high performance and even low power consumption is still growing. As such, developing advanced semiconductor manufacturing technologies is stra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rnpy55 |