The research of the optimizing design for the glue jetting pump shooting accuracy

碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === The System-in-package (SIP) technology possess the advantages to decrease the printed circuit board (PCB) area, reduce the number of PCB layers and the electromagnetic interference signal interference on passive or active components. Therefore, the formation o...

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Bibliographic Details
Main Authors: LIN, SHI-HAO, 林仕豪
Other Authors: JONG, GWO-JIA
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/h2ty5h