Study on Surface Treatment by Atmospheric Pressure Plasma on BGA of FPC to Improve Electroplating Ability
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 106 === Ball grid array, BGA, for load integrated circuit is common pattern design in FPC. There are the skip plating issue and the appearance abnormal after plating, because the BGA aperture diameter is small than 0.3 mm or unclean on copper surface. In th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e6f3jg |