Study on Preparation of High Thermal Conductivity Encapsulants and Their Thermal Curing Behaviors
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 106 === Epoxy resin systems are usually used for encapsulating electronic device, because of their high thermal stability, high moisture resistance and low cost. For the latest few decades, there has a trend for die and package sizes to shrink, driven by th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/q46be4 |