The effect of storage time and nickel layer on electroplated Cu/Sn interfacial reaction
碩士 === 國立中興大學 === 化學工程學系所 === 106 === Solder used in packaging comprehensively connects to electronic components. Lead solder poisoning and toxic is proved. The Restriction of Hazardous Substances Directive (RoHS) adopted in 2003, and lead is also restricted substance. Products contain lead solder s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/g46smw |