Image Based Automatic Defect Inspection of Substrate, Die Attach and Wire Bond in IC Package Process

碩士 === 國立中興大學 === 資訊管理學系所 === 106 === With the development of global technology, all modern electronic products are operated through these integrated circuits (ICs). Personal computers, smart phones, and televisions are rely on it to execute various key procedures. In the future, home appliances and...

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Bibliographic Details
Main Authors: Cheng-Siang Jhang, 張程翔
Other Authors: 詹永寬
Format: Others
Language:en_US
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/29j252