Issues Study and Solution in Semiconductor Wafer Packaging System
碩士 === 國立中興大學 === 電機工程學系所 === 106 === Abstract This study focuses on the BGA products in the packaging industry (BGA, CSP, ...), which can be further classified into PBGA, EDHS-BGA, and Flip Chip Page. This thesis presents issues and solution faced by packaging techniques in various fabrication stag...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/g7m39m |