| Summary: | 碩士 === 國立中興大學 === 電機工程學系所 === 106 === Abstract
This study focuses on the BGA products in the packaging industry (BGA, CSP, ...), which can be further classified into PBGA, EDHS-BGA, and Flip Chip Page. This thesis presents issues and solution faced by packaging techniques in various fabrication stages. It is realized that abnormality during packaging process is often related to four basic elements, i.e., people, work, material, and machine. Therefore, investigation should emphasize on locating the problem source and identifying appropriate temporary and permanent measures to prevent reoccurrence of the problem. We find out the cause by accurate anomaly analysis, and utilize it to simulate and decide whether the situation could be induced by other causes. This effectively stops the occurrence of anomalies and significantly improves the yield, which creates a win-win situation for both customers and companies.
|
|---|
