Optimization of Copper Wire Bonding Process of ICs Package by Taguchi Methods
碩士 === 國立中興大學 === 電機工程學系所 === 106 === In recent years, due to the acceleration of the price of gold, the rapid development of the IC (Integrated Circuit) package copper process has become the mainstream of the packaging industry. This research is aimed at the copper package process to improve the pa...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/j9xutz |