A study about optimization in fine pitch copper wire bonding process
碩士 === 國立勤益科技大學 === 工業工程與管理系 === 106 === In the semiconductor industry packaging process technology, the copper wire bonding process has a strategic introduction trend in the IC packaging industry. It is the best countermeasure for the cost reduction of the packaging factory. It can reduce the mater...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/h4ub8p |