Reliability Analysis of 2.5D Structure and Flip Chip Die Stacking Packaging
碩士 === 國立成功大學 === 工程科學系碩士在職專班 === 106
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/cr6869 |