Development of High Density Plasma Etching Technology for Silicon Wafer Dicing
碩士 === 國立成功大學 === 化學工程學系 === 106 === In this study, plasma dicing was performed using inductively coupled plasma to generate high density plasma. The plasma dicing technology was based on Bosch process to conduct deep silicon etching. By adjusting the passivation and etching process, the dicing prof...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6kwwyc |