Development of High Density Plasma Etching Technology for Silicon Wafer Dicing
碩士 === 國立成功大學 === 化學工程學系 === 106 === In this study, plasma dicing was performed using inductively coupled plasma to generate high density plasma. The plasma dicing technology was based on Bosch process to conduct deep silicon etching. By adjusting the passivation and etching process, the dicing prof...
Main Authors: | Ya-WeiLiao, 廖亞威 |
---|---|
Other Authors: | ZHAO-NAN HONG |
Format: | Others |
Language: | zh-TW |
Published: |
2018
|
Online Access: | http://ndltd.ncl.edu.tw/handle/6kwwyc |
Similar Items
-
Generation of dicing damage in silicon wafers
by: Ebbutt, Ralph
Published: (2007) -
The Dicing Method for Thin Silicon Wafer
by: You-Cen Liu, et al.
Published: (2009) -
Chipping Analysis of Dicing Silicon Wafer Process
by: Zhao-Wei Wang, et al.
Published: (2000) -
Wafer to wafer control of etching rate in Transformer Coupled Plasma Processing Equipment
by: Mu sheng Liao, et al.
Published: (2005) -
Etching performance of silicon wafers with redesigned etching drum
by: Dolah, Rozzeta
Published: (2006)