Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow
碩士 === 國立成功大學 === 材料科學及工程學系 === 106 === The microstructure and growth behavior of intermetallic compound (IMC) formed between Zn-25Sn-xTi (x = 0,0.02,0.05,0.08) and Cu were investigated at high temperature (415°C) and low temperature (220°C) in this study. Microstructure observation of the solder al...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/v44wm7 |