Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow
碩士 === 國立成功大學 === 材料科學及工程學系 === 106 === The microstructure and growth behavior of intermetallic compound (IMC) formed between Zn-25Sn-xTi (x = 0,0.02,0.05,0.08) and Cu were investigated at high temperature (415°C) and low temperature (220°C) in this study. Microstructure observation of the solder al...
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ndltd-TW-106NCKU51590122019-10-31T05:22:14Z http://ndltd.ncl.edu.tw/handle/v44wm7 Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow 鋅錫鈦無鉛銲錫多重迴焊過程的界面反應行為之研究 WilliamHonggo 吳詩良 碩士 國立成功大學 材料科學及工程學系 106 The microstructure and growth behavior of intermetallic compound (IMC) formed between Zn-25Sn-xTi (x = 0,0.02,0.05,0.08) and Cu were investigated at high temperature (415°C) and low temperature (220°C) in this study. Microstructure observation of the solder alloys at high temperature shows that CuZn5, Cu5Zn8, CuZn were formed at the interface. The CuZn5 and Cu5Zn8 IMC were formed at the interface after one reflow. The thickness increased with increasing reflow number up to 10. After ten reflows, a third IMC layer appeared with the same planar shape and identified to be CuZn. The growth mechanisms were investigated and showed that Cu5Zn8 growth follows diffusion controlled reaction, while the CuZn5 follows reaction controlled mechanism. The multiple reflow experiment was also conducted in lower temperature (220°C) for the as-reflowed joint. The thickness of CuZn5 decreased with the increase of the titanium added although no apparent change of total IMC thickness. After establishing the IMC growth mechanism of the high temperature Zn-25Sn-xTi solders, the specimens aged to investigate its interfacial reaction behavior during aging. The growth rate of the IMC increased with the increase of the titanium added. Kwang-Lung Lin 林光隆 2018 學位論文 ; thesis 112 en_US |
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碩士 === 國立成功大學 === 材料科學及工程學系 === 106 === The microstructure and growth behavior of intermetallic compound (IMC) formed between Zn-25Sn-xTi (x = 0,0.02,0.05,0.08) and Cu were investigated at high temperature (415°C) and low temperature (220°C) in this study. Microstructure observation of the solder alloys at high temperature shows that CuZn5, Cu5Zn8, CuZn were formed at the interface. The CuZn5 and Cu5Zn8 IMC were formed at the interface after one reflow. The thickness increased with increasing reflow number up to 10. After ten reflows, a third IMC layer appeared with the same planar shape and identified to be CuZn. The growth mechanisms were investigated and showed that Cu5Zn8 growth follows diffusion controlled reaction, while the CuZn5 follows reaction controlled mechanism. The multiple reflow experiment was also conducted in lower temperature (220°C) for the as-reflowed joint. The thickness of CuZn5 decreased with the increase of the titanium added although no apparent change of total IMC thickness. After establishing the IMC growth mechanism of the high temperature Zn-25Sn-xTi solders, the specimens aged to investigate its interfacial reaction behavior during aging. The growth rate of the IMC increased with the increase of the titanium added.
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author2 |
Kwang-Lung Lin |
author_facet |
Kwang-Lung Lin WilliamHonggo 吳詩良 |
author |
WilliamHonggo 吳詩良 |
spellingShingle |
WilliamHonggo 吳詩良 Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow |
author_sort |
WilliamHonggo |
title |
Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow |
title_short |
Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow |
title_full |
Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow |
title_fullStr |
Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow |
title_full_unstemmed |
Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow |
title_sort |
interfacial reaction between zn-25sn-xti pb-free solder alloys and cu substrate under multiple reflow |
publishDate |
2018 |
url |
http://ndltd.ncl.edu.tw/handle/v44wm7 |
work_keys_str_mv |
AT williamhonggo interfacialreactionbetweenzn25snxtipbfreesolderalloysandcusubstrateundermultiplereflow AT wúshīliáng interfacialreactionbetweenzn25snxtipbfreesolderalloysandcusubstrateundermultiplereflow AT williamhonggo xīnxītàiwúqiānhànxīduōzhònghuíhànguòchéngdejièmiànfǎnyīngxíngwèizhīyánjiū AT wúshīliáng xīnxītàiwúqiānhànxīduōzhònghuíhànguòchéngdejièmiànfǎnyīngxíngwèizhīyánjiū |
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