The Microstructure and Tensile Properties of Zn-25Sn-xCu-yTi High Temperature Pb-free Solder Alloys
碩士 === 國立成功大學 === 材料科學及工程學系 === 106 === This study investigated the effect of Cu (0.1, 0.2, 0.3, 0.4 wt%) and Ti (0.01, 0.02, 0.04 wt%) additions on the thermal properties, tensile properties and microstructure of high temperature Zn-25Sn-xCu-yTi solder alloys. The liquidus temperature increased wit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/535j32 |