Thermal Performance of a Building Material Incorporating Micro-encapsulated Phase Change Material (mPCM)─The Aluminum Honeycomb Board as an Example

博士 === 國立成功大學 === 建築學系 === 106

Bibliographic Details
Main Authors: Pin-FengLiu, 劉濱鳳
Other Authors: Chun-Ta Tzeng
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/3efyu4