Thermal-aware Memory System Design Automation Method for Multi-Processor System-on-Chips with 3D-stacked Hybrid Memories
碩士 === 國立暨南國際大學 === 資訊工程學系 === 106 === Stacking memories on Multi-Processor System-on-Chips (MPSoCs) by Through-Silicon Vias (TSVs) provides high speed and wide bandwidth to overcome the memory wall problem and supply heterogeneous integration to integrate resources vertically. However, it is prone...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/kzn2cx |