Effect of Seed Layers and Substrates on the Growth of Electroplated Nanotwinned-copper Films
碩士 === 國立交通大學 === 材料科學與工程學系奈米科技碩博士班 === 106 === Copper has become the most important conducting material in packaging industry. Nanotwinned copper (nt-Cu) can strengthen the Cu film and remain high conductivity at the same time. Nt-Cu also shows stunning performance in many respects of microelectron...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8y7543 |