Development and Investigation of 3D-IC Heterogeneous Integration Platforms and Fan-out Wafer Level Package Technologies
博士 === 國立交通大學 === 電子研究所 === 106
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hcg84j |