Transient Thermal Characterization Study and Measurement Method Design for Package-level Power Semiconductor Device
博士 === 國立交通大學 === 機械工程系所 === 106 === In this study, transient thermal analyses are used to study the thermal performance of recently cascoded GaN switch. This technique is based on thermal characterization of device on-resistance (RON) extraction with synchronized current-voltage characteristics und...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8xmxm2 |