Investigating Warpage and Stress Distribution of Fan-Out Panel Level Packaging
碩士 === 國立交通大學 === 機械工程系所 === 106 === This research aims to investigate the warpage of the fan out panel level packaging (FOPLP) induced by thermal process through finite element analysis. Firstly, based on the warpage experiment of epoxy molding compound (EMC) and glass, this research characterize t...
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| Format: | Others |
| Language: | zh-TW |
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2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/qqumak |