Thermal Improvement of High Power LED Chip Scale Package by Using Thin Metal Package Technique
碩士 === 國立交通大學 === 光電科技學程 === 106 === In solid state lighting, such as light emitting diode (LED), the light emission efficiency will decrease with the temperature increase. Therefore, the heat dissipation is one of the key factors in thermal management, in particular, for high power LED applications...
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| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7b93n5 |