Electromigration Study of Ni/SnAg/Ni Flip-Chip Solder Joints
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 106 === As the size of electronic products continues to shrink, the circuit design of Flip Chip ICs have to take into account the electromigration effect due to high operation temperature and high current density. Flip-chip technology has become a mainstream tre...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rgda7y |