Preparation of Three-dimensional Micro Structure of Cu-Sn Intermetallic Compound by Micro-electroplating
碩士 === 國立中央大學 === 材料科學與工程研究所 === 106 === In this study, micro-anode guided electroplating was used to manufacture three dimensional micro-structures of Cu-Sn intermetallic compound. The electroplating system uses a platinum wire with a wire diameter of 125 μm as an anode, and a copper wire with a di...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/5hf25n |